Article source: Content compiled by Semiconductor Chip News (ID: MooreNEWS) from eetjp

Fuji Economy announced in April 2024 that the global power semiconductor wafer market will grow to 1076.3 billion yen by 2035, and is expected to reach 281.3 billion yen in 2024. Especially, SiC (silicon carbide) bare wafers are expected to surpass the market size of Si (silicon) wafers by 2024, and are expected to continue driving the power semiconductor wafer market.

This survey targets 8 projects, including silicon wafers, SiC bare wafers, SiC epitaxial wafers, GaN (gallium nitride) wafers, gallium oxide wafers, diamond wafers, aluminum nitride wafers, and germanium dioxide wafers. However, the market size of aluminum nitride wafers and germanium dioxide wafers has not been calculated. The survey period is from February 2024 to March 2024.

It is expected that the power semiconductor wafer market will grow by 23.4% in 2024 compared to 2023. Although the silicon wafer market has declined compared to the previous year due to inventory adjustments in silicon power semiconductors, SiC bare wafers have grown by 56.9%. Major SiC wafer manufacturers have increased their production capacity and achieved better performance than Si wafers. Starting from 2025, with the progress of automotive electrification, the SiC bare chip market is expected to continue expanding. The silicon wafer market is also expected to recover. In addition, the increase in GaN wafer diameter and the mass production of gallium oxide wafers will also be factors. In addition, diamond wafers, aluminum nitride wafers, germanium dioxide wafers, and other materials are expected to be put into practical use.

We also investigated the composition ratio of power semiconductor wafers by size. It is expected that 8-inch wafers will continue to account for over 60% of silicon wafer sales. 12 inch wafers are increasingly being used for IGBTs and MOSFETs, and the demand for power semiconductors in automotive applications is expected to increase. Most SiC bare wafers are 6 inches in size. Although this situation will continue for the time being, the composition ratio of 8-inch wafers currently under development is expected to reach 13.3% by 2035.

Original link：https://eetimes.itmedia.co.jp/ee/articles/2404/19/news061.html

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