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AIR LIQUIDE 气相沉淀设备 AFC - TEOS - CAD - 30 - P,以 TEOS 为前驱体,通过化学气相沉积在衬底上形成高质量氧化硅薄膜,用于半导体制造中的绝缘、隔离及钝化等工艺。
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