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400-0305-668
库存状态:现货
TOKYO SEIMITSU 划片机 A - WD - 300TX,能精准切割晶圆,具有高速度、高精度的特点。可实现微米级定位,切割道宽度小。主要应用于半导体制造中的晶圆划片、分割等工序,是芯片封装环节的关键设备3。
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