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400-0305-668
库存状态:现货
TDK 晶圆装载端口设备 TAS300 可实现晶圆从 FOUP 到工艺腔室的自动化传输,具备精确对位、高效装卸功能。主要应用于半导体制造中晶圆的自动化生产环节,保障晶圆在不同工序间的洁净、高效流转。
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list
Current boot status
Date of Production
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On site inspection of goods
Sending samples for testing
Contract Signing
Express delivery acceptance
On site acceptance and shipment
Provide services based on the actual situation of the machine