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400-0305-668
库存状态:现货
日立国际电气扩散炉 T2DC6 - 12600 - 24,能在高温环境下,利用热扩散原理将杂质元素掺入半导体晶圆。主要应用于半导体制造,用于精确控制晶圆杂质分布,以形成特定电学性能区域,满足芯片制造需求。
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