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库存状态:现货
EUGENE TECHNOLOGY 沉积刻蚀设备 BJM - e 用于半导体制造。它能通过物理及化学方法,在晶圆表面衬底及功能材料上进行沉积和刻蚀操作,实现掩模图形到晶圆表面的转移,以雕刻出集成电路所需的立体微观结构1。
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