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400-0305-668
库存状态:现货
佳能机械公司的高速环氧芯片键合机 BESTEM - D02,主要用于半导体制造中芯片与基板的连接。它通过高速精确的操作,将芯片快速、牢固地键合到基板上,确保电气连接良好,提高生产效率和产品质量。
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