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400-0305-668
库存状态:现货
ALPHA键合机HSB - 300D是电子封装和芯片封装领域的关键设备2。它利用先进键合技术,如金线、铜线或激光键合等,将芯片与引线、基板等器件精确连接,实现电路功能,确保连接的高效性、高精度和高可靠性2。
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