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RUDOLPH TECHNOLOGIES CORP RUDOLPH 晶圆检测系统 NSX-115d1

库存状态:现货

RUDOLPH NSX-115d1 晶圆检测系统专为半导体制造设计,采用高速光学显微镜技术,可检测晶圆在制造、探针测试及切割过程中产生的宏观缺陷(≥0.5μm),如探针标记、划痕等,并生成位置与尺寸数据3。其集成的 WaferWorx 分析模块可自动化分解探测误差,快速定位探针台、探针卡等环节问题,支持多 DUT 和高引脚数探针卡的预验证313。适用于逻辑芯片、存储芯片、先进封装等场景,尤其在探针工艺优化及缺陷溯源中提升良率与效率。该系统以高精度和高可靠性满足量产需求,覆盖晶圆制造全流程质量监控。

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Information Service
Information Service

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Product Name

Product Name

Product Model

Product Model

list

list

Current boot status

Current boot status

Date of Production

Date of Production

Current situation confirmation
Current situation confirmation
Online images

Online images

Remote Video

Remote Video

On site inspection of goods

On site inspection of goods

Sending samples for testing

Sending samples for testing

Equipment Acceptance
Equipment Acceptance
Contract Signing

Contract Signing

Express delivery acceptance

Express delivery acceptance

On site acceptance and shipment

On site acceptance and shipment

After sales guarantee
After sales guarantee
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Provide services based on the actual situation of the machine