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RUDOLPH NSX-115d1 晶圆检测系统专为半导体制造设计,采用高速光学显微镜技术,可检测晶圆在制造、探针测试及切割过程中产生的宏观缺陷(≥0.5μm),如探针标记、划痕等,并生成位置与尺寸数据3。其集成的 WaferWorx 分析模块可自动化分解探测误差,快速定位探针台、探针卡等环节问题,支持多 DUT 和高引脚数探针卡的预验证313。适用于逻辑芯片、存储芯片、先进封装等场景,尤其在探针工艺优化及缺陷溯源中提升良率与效率。该系统以高精度和高可靠性满足量产需求,覆盖晶圆制造全流程质量监控。
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