TOSHIBA IT S CONTROL SYSTEMS CORPORATION X射线检测系统 TOSMicron-S5110IN

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东芝 TOSMicron-S5110IN X 射线检测系统专为半导体及精密电子元件设计，采用微焦斑 X 射线技术实现亚微米级分辨率成像，可穿透封装材料检测内部结构缺陷（如焊点空洞、金属线短路）9。系统集成三维重建与 AI 算法，自动识别纳米级缺陷并生成工艺关联分析报告，支持半导体封装、汽车电子等领域的质量控制与失效分析。其非破坏性检测特性适用于高价值器件的全检或抽样检测，显著提升良率并优化制程参数。

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