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400-0305-668
库存状态:现货
NOVA 晶圆检测设备 NOVASCAN3090-300 专为半导体制造设计,具备高精度缺陷检测与关键尺寸量测能力。其采用先进光学或电子束技术,可识别晶圆表面纳米级缺陷,支持 300mm 晶圆的全片扫描,适用于逻辑芯片、存储芯片等制程的在线检测与工艺监控,帮助提升良率并优化生产流程。
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