ANELVAアネルバ株式会社沉积设备 L-1201 PVD

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库存状态：现货

ANELVA L-1201 PVD 是高精度物理气相沉积设备，支持 300mm 晶圆，采用磁控溅射与离子束技术，可沉积金属、氧化物等薄膜，膜厚均匀性达 ±2.5%15。设备集成多腔室设计，支持铜阻挡层、种子层等复杂工艺，适用于半导体互连、功率器件及新型存储器（如 MRAM）制造47。其真空环境（≤7×10⁻⁷Torr）与自动化控制系统确保纳米级薄膜的一致性，广泛应用于逻辑芯片、显示面板及先进封装领域614。

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