LAM 底板 810-800082-309 - Haixiang Technology Co., Ltd

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LAM 底板 810-800082-309

库存状态：现货

LAM 底板 810 - 800082 - 309 是泛林半导体设备中的组件。其功能是为设备各模块提供电气连接、信号传输和物理支撑，确保各部分间稳定的数据交互与协同工作。它采用多层 PCB 设计，具备良好的抗干扰能力和电气性能。该底板应用于半导体制造设备中，如蚀刻、沉积等工艺设备，能满足高精度工艺对信号传输和稳定性的严格要求，保障生产过程的可靠性和产品质量。

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