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400-0305-668
库存状态:现货
TDK 晶圆传送负载端口设备 TAS300,用于半导体制造中晶圆传送。能实现晶圆在 FOUP 与制造设备间自动传输,具备快速开关门及防尘粒设计,应用于 300mm 晶圆相关的半导体生产工艺。
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