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库存状态:现货
佳能机械公司的高速环氧芯片键合机 BESTEM - D02,能快速精准地将芯片与基板通过环氧材料键合,具有高速度、高精度的特点。主要应用于半导体封装领域,适用于多种芯片类型,可提高生产效率和封装质量。
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