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400-0305-668
库存状态:现货
DISCO DFL7340 晶圆切割机采用激光隐形切割技术,定位精度高,能实现精细切割,可加工多种形状。适用于半导体晶圆、化合物半导体等材料,在芯片制造、MEMS 加工等领域用于将晶圆切割成芯片。
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