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DISCO DFL7340 晶圆切割机

库存状态:现货

DISCO DFL7340 晶圆切割机采用激光隐形切割技术,定位精度高,能实现精细切割,可加工多种形状。适用于半导体晶圆、化合物半导体等材料,在芯片制造、MEMS 加工等领域用于将晶圆切割成芯片。

TRADING GUID

Information Service
Information Service

Checking information before purchasing second-hand products is a very important step, as it can help you avoid potential risks and ensure that you purchase products that meet your needs and have reliable quality.

Product Name

Product Name

Product Model

Product Model

list

list

Current boot status

Current boot status

Date of Production

Date of Production

Current situation confirmation
Current situation confirmation
Online images

Online images

Remote Video

Remote Video

On site inspection of goods

On site inspection of goods

Sending samples for testing

Sending samples for testing

Equipment Acceptance
Equipment Acceptance
Contract Signing

Contract Signing

Express delivery acceptance

Express delivery acceptance

On site acceptance and shipment

On site acceptance and shipment

After sales guarantee
After sales guarantee
根据机器实际情况提供服务

Provide services based on the actual situation of the machine