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库存状态:现货
V - TECHNOLOGY LH - VL - C60 半导体激光切割机,利用半导体泵浦激光器产生高能量激光束进行切割,具有精度高、速度快、光束质量佳等特点,主要应用于半导体材料加工、电子元件制造等领域。
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